Xiaomi announced the launch of the Xiaomi-MediaTek Joint Laboratory in Shenzhen, China. This laboratory focuses on five core capabilities and three main technical areas: performance, communication, and AI. Both companies aim to explore the underlying technologies to deliver superior products. The first flagship product from this new collaboration is the Redmi K70 Extreme Edition (aka. Redmi K70 Ultra).
Xiaomi also revealed that over the past three years, more than 18.6 million units of Redmi Dimensity flagship platform mobile phones have been shipped, and the Xiaomi Group has shipped a total of 680 million units of products using the MediaTek platform.
As far as the Redmi K70 Ultra is concerned, the device will come equipped with MediaTek’s latest flagship chipset, the Dimensity 9300 Plus. As per reports, the device will compete with three Snapdragon 8 Gen 3 phones, such as the OnePlus Ace 3, the Realme GT 6, and the iQOO Neo 9S Pro+. While the OnePlus phone has already launched, the Realme and iQOO smartphones are said to debut on July 9 and July 11, respectively, in China.
Redmi K70 Ultra specifications (rumored)
As mentioned above, the Redmi K70 Ultra will have the Dimensity 9300+ chipset. It is speculated that the topmost variant of the device will have 24 GB of RAM and 1 TB of storage. It is expected to feature a dedicated graphics engine for an enhanced gaming experience.
The K70 Ultra will house a 5,500mAh battery with 120W fast charging. The brand has already confirmed that it will be an IP68-rated dustproof and water-resistant device. Additionally, it is also expected to feature a metal middle frame.
As far as the launch is concerned, the Redmi K70 Ultra is likely to debut by the middle of this month (July) in China. The brand is yet to reveal the design of the smartphone.
