A fresh new leak suggests that Huawei is working on next-generation Taishan cores, which promise significant performance and power efficiency improvements over the current Kirin 9000s cores. This development could lead to a major boost for future Kirin chips.
Tipster Jasonwhoill on X (formerly Twitter) claims that Huawei is testing new Taishan cores that surpass the performance of the Kirin 9000s processor. These cores, similar in design to Apple’s small cores, reportedly achieve exceptionally low power consumption.
According to the leak, the new cores scored 350 points in single-core Geekbench 5 testing, compared to the Kirin 9000s cores’ 200 points. Currently, the Kirin 9000s utilizes Cortex-A510 low-energy cores, the first ARMv9 ‘LITTLE’ CPU cores, which were also seen in Qualcomm’s Snapdragon 8 Gen 1 chip back in 2022.
There is also a rumor that Huawei is developing a Kirin PC chip with the Taishan V130 architecture, which could rival Apple’s M3.
A previous report indicated that a new CPU architecture might be used in the upcoming Mate 70 series, potentially featuring a powerful 5nm chipset, signaling an evolution in Huawei’s smartphone technology.
However, Huawei has not confirmed any of these developments, so it’s wise to take this information with caution.
There are ongoing discussions about a new Kirin chipset and its CPU architecture, with claims that it could surpass the performance of the Kirin 9000s. These rumors, however, contradict Huawei’s previous statements.
The company has emphasized improving existing 7nm chips rather than developing entirely new technologies. Additionally, US sanctions limit Huawei’s access to advanced chip-making equipment, hindering its ability to compete technologically.
For now, the situation surrounding these rumors remains unclear. Hopefully, more information will emerge in the coming days to clarify this developing story.
