Lately, Samsung has been in the news for its upcoming foldables and wearables, but the company’s next S-series flagship isn’t far from the spotlight either.
A recent post from frequent leaker Ice Universe on the Chinese social media platform Weibo offers some interesting details about what to expect from the S25 Ultra.
The tipster claims a design shift for the next flagship. Ice Universe suggests the S25 Ultra will be slimmer than its predecessor, measuring 8.4mm thick compared to the S24 Ultra’s 8.6mm.
Although this difference in size is marginal, the post also reveals that Samsung isn’t compromising on camera capabilities for the sake of slimness. While specifics are still under wraps, rumors suggest the S25 Ultra will feature an improved 200MP main camera, along with 50MP ultrawide, 50MP 3x telephoto, and 50MP 5x telephoto lenses.
In a separate post on X (formerly Twitter), the tipster revealed another detail about the design. According to Ice Universe, the S25 Ultra will “not crush your palm again” and will be “really rounded!”
This means the S25 Ultra will move away from the sharp corners Samsung introduced with the S24 Ultra and will likely adopt a curved design similar to the S23 Ultra and S22 Ultra. The tipster seems quite confident about this change, stating there’s a “100%” chance of it happening.
While this seems like a reliable leak, another rumor earlier this week suggested that Samsung might introduce MediaTek chips into the S25 series for the first time. This would take the SoC count for Samsung’s S-series flagship to three, including Qualcomm, Samsung’s own Exynos chips, and MediaTek.
However, the same source that reported this news cautions that the possibility of MediaTek chips remains a rumor, and its actual inclusion should be viewed with skepticism.
Samsung has plenty of time before launching the Galaxy S25 series. Currently, the company’s focus is on the Galaxy Z Fold 6, Z Flip 6, and wearables, including the Galaxy Ring, Buds 3 series, and new Galaxy watches, all of which will be unveiled at the July 10th Unpacked event.
