Today’s roundup brings you the most exciting tech stories from the past 24 hours. We get a sneak peek at the Galaxy Z Fold 6’s wider cover screen, a fantastic deal on the OnePlus 11R in India, and China’s massive $47.5 billion push for semiconductor self-sufficiency. Plus, discover Sharge’s new powerhouse Silver Wing Pro Power Bank and MediaTek’s latest Dimensity 7300 series chipsets designed to elevate your gaming experience.

Here are all the top stories from the past 24 hours.

Leaked images show Galaxy Z Fold 6’s wider cover screen and comparison with Z Fold 5

A leaked image suggests the upcoming Samsung Galaxy Z Fold 6 will address a long-standing user request: a wider cover screen. The image, which trustworthy tipster Ice Universe shared, contrasts the Galaxy Z Fold 6 with its predecessor, the Z Fold 5, and clearly shows a larger cover display.

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OnePlus 11R 8GB + 128GB model selling for ₹27,999 on Amazon India

Earlier this month, the OnePlus 11R was available for ₹29,999 in India, with an extra ₹2,000 discount for certain bank card holders. Now, OnePlus is offering the device at an even lower price of ₹27,999, along with additional benefits for Canara Bank credit card users.

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China launches $47.5 billion Big Fund III to boost semiconductor self-sufficiency

To increase self-sufficiency in the semiconductor sector, China has launched the third phase of its National Integrated Circuit Industry Investment Fund, commonly known as Big Fund III. Established last week, this new fund boasts a registered capital of 344 billion yuan (approximately $47.5 billion), making it the largest state-backed investment in China’s semiconductor industry to date.

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Sharge Unveils the Silver Wing Pro Power Bank with 20,000 mAh Capacity, 140W Max Fast Charging

Sharge‘s press conference tonight brought exciting news for mobile power users, unveiling the Silver Wing Pro Power Bank. It is a game-changer for those who need serious mobile charging power. This high-capacity device boasts impressive features designed to keep you connected no matter where you are.

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MediaTek launches Dimensity 7300 series with improved gaming and AI performance

MediaTek today released two new mid-range chipsets – the Dimensity 7300 and Dimensity 7300X. Both of the chips are fabricated on a 4nm process node and are said to offer 25% lower power consumption on the performance cores when compared with Dimensity 7050.

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