Qualcomm has announced a new chipset – the Snapdragon 888 Plus. The chipset will appear in phones launching in the second half of the year, and among the confirmed devices it will power is the Honor Magic 3 series flagship.
The info was confirmed in Qualcomm’s press release along with a statement from an Honor company executive. According to Fang Fei, the president of product line, Honor Device Co., Ltd “…The game-changing advancements we see in the new Snapdragon 888 Plus 5G Mobile Platform make it a perfect fit for HONOR’s upcoming Magic3 series flagship.”
Prior to the launch of the Snapdragon 888 Plus, there were reports that Honor will launch the Magic 3 in August and it will be powered by the Snapdragon 888 Pro. The Snapdragon 888 Plus was originally referred to as the Snapdragon 888 Pro.
Honor plans to announce two Magic phones this year. It has been reported that one will be a foldable device and it is expected to launch as the Honor Magic Fold.
Qualcomm’s press statement also kills the rumor that the chipset will be exclusive to Honor as it confirms that other manufacturers will also announce phones powered by the chipset. ASUS’s general manager of smartphone business, Bryan Chang, has confirmed that the Snapdragon 888 Plus will appear in a ROG phone. Vivo and Xiaomi have also confirmed that they will announce phones powered by the new processor. We also expect other brands not stated above to have a Snapdragon 888 Plus phone in the pipeline.
At the moment, we do not know which phone will launch first but we will update you once we have more details.
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