Qualcomm recently unveiled its latest flagship chipset — Snapdragon 865 Plus, which as the name indicates, is an upgraded variant of the Snapdragon 865 SoC that was launched by the company last year.
Now, the company is gearing up to launch its next-generation flagship chipset, which is likely to be named Snapdragon 875. While the company is yet to officially acknowledge this, the leaked future chips roadmap has revealed some information.
A Weibo user has shared an image showcasing Qualcomm‘s product planning for the upcoming chipsets. It reveals that the Snapdragon 662 and Snapdragon 460 SoC will be launched in this fourth quarter of this year.
Further, the Snapdragon 875G and Snapdragon 435G will be unveiled in Q1 2021. Apart from these, the Snapdragon 735G is expected to get launched in Q1 or Q2 next year.
Interestingly, the standard Qualcomm Snapdragon 875 SoC is missing from the list. If the company plans to launch it, we expect it to get announced in December this year, similar to the previous flagship chipset launch from the company.
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The leak reveals that the SD875G and SD735G are the flagship and mid-range chipsets from Qualcomm, set to launch in 2021. Both of them are manufactured using Samsung’s 5nm EUV process which increases performance by 10 percent and reduces power consumption by 20 percent.
Qualcomm is expected to use the combination of Cortex X1 Super Core + Cortex A78 Large Core for the upcoming Snapdragon 875G chipset. With such architecture, the chipset could break the performance records when it comes to chipsets powering Android smartphones.
The leak also reveals that Qualcomm’s rival MediaTek is set to launch Dimensity 600 chipset in the third quarter of this year, i.e. in Q3 2020. It has been reported that the Taiwan-based company has received a large number of orders for the upcoming chipset.
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